Industry Solution

Semiconductor & Precision Metal | AiPS Assembly Kitting Plan

For precision equipment and component assembly, calculates material readiness using BOM levels, purchase/make lead times, WIP status and assembly sequence to identify shortages early and synchronize assembly scheduling.

Semiconductor & Precision Metal | AiPS Assembly Kitting Plan
01 Business Challenge02 Solution Logic03 Core Capabilities04 GT Product Fit05 Value06 Demo
01
BUSINESS CHALLENGE

Why the current approach does not scale

Precision equipment assembly often has deep BOMs, mixed buy/make supply, long-lead items and substitutes. Planners struggle to answer when material will truly be ready, causing premature scheduling, shortages or excess early inventory.

02
SOLUTION LOGIC

How GT solves it

Calculate earliest material-ready date by BOM level using inventory, open purchasing, make WIP, procurement lead time, production cycles and substitutes. AiPS then schedules only executable assembly orders.

03
CORE CAPABILITIES

Turn business constraints into system capabilities

01Multi-level BOM readiness calculation
02Inventory, open supply and make-WIP linkage
03Long-lead and critical-shortage identification
04Substitute availability and rule control
05Material-ready dates directly drive assembly scheduling
04GT PRODUCT FIT

Composable capabilities, not an isolated application

DataEx Hub aggregates ERP/purchasing/WIP data and standardizes material semantics; AiPS uses CTB results as scheduling windows; PLM + ERP Lite supplies BOM and engineering changes.

05
BUSINESS VALUE

Outcomes should be measurable by the business

01

Fewer shortage-driven starts and assembly waits

02

Less unnecessary early material and inventory

03

Better alignment between planning and purchasing

04

Delivery promises based on real material readiness

DEMO

From BOM readiness to assembly scheduling

Select a multi-level BOM order, calculate buy/make readiness, then see how AiPS schedules assembly based on CTB dates.

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